搜索资源列表
Atool
- A tool portfolio elimination mechanism (TPEM) for a wafer fab
Atool
- A tool portfolio elimination mechanism (TPEM) for a wafer fab
SCommTest
- 通过串口控制FPGA晶圆测试电路的软件，用于学生做相关实验-FPGA through the serial control circuit wafer testing software for students to do experiments
02MemRepair
- 内存修改，用该进程可以修改内存中的数据，如在金山游侠中可以修改选手的生命值等-Redundancy Repair is a process step almost exclusively used for memory chips. The best way to think of this is via the analogy of the spare wheel in a car. The spare is a redundant
Timedelayfunction
- 一个基于12M和6M晶振的延时函数，包括1us,2us,5us10us,20us,50us100us,200us,500u1ms,2ms,5ms10ms,20ms,50ms 0.1s,0.2s,0-Based on a wafer 12M 6M and vibration of delay function, including 1us, 2us, 5us10us, 20us, 50us100us, 200us, 500u1ms, 2m
FabricationAndPackagingOfWafer
- 本文件为pdf格式，主要介绍微电子行业中晶圆的制造和封装。-Pdf format for this document, mainly the microelectronics industry, wafer manufacturing and packaging.
OP07_a
- The OP07 has very low input offset voltage (75 μV max for OP07E) which is obtained by trimming at the wafer stage. These low offset voltages generally eliminate any need for external nulling. The OP07 also features
Taiwan_wafer_VHDL_training_materials
- 台湾晶元内部VHDL培训资料 大量c语言例程 讲解主要为英文 少量繁体中文-Taiwan wafer training materials, a large number of c within the VHDL language routines deal mainly with a small amount of English Traditional Chinese
Capacitor_Voltage_test
- 控制吉时利公司的CV590设备，来测试半导体器件以及分立器件的电容及电导程序及算法。-control CV590 intruments to measure capacitor and conductor of wafer or capacitor.
Reliablity_ramp
- 实现了Jedec标准中对超薄膜氧化层的MOS电容的Time-zero可靠性测试方法。可直接用于半导体器件可靠性测试中-a realization of Time-zero dilectric breakdown according to Jedec standard,which can use to achieve reliability of wafer
H.264_MPEG-4_AVC.ZIP
- H264 MPEG4 AVC画面编码器之架构设计与晶片制作，台湾硕士论文-H264 MPEG4 AVC encoder of the structure of the screen design and wafer production, Taiwan, Master s thesis
pxa270um
- 是学习嵌入式的很好的一块板子，ARM系列。对于入门的新手来说 很好-it s about pxa270um,a circuit wafer of arm.
data_obj.py
- Python object for wafer data management
attachments_2010_04_24
- Chapter 7 Metallization Definition: Processes that deposit metal thin film on wafer surface Applications Interconnection Gate and electrodes Chapter 9 Manufacturing Issues Nanolithography RIE
eM_P
- eM_Plant虚拟晶圆制造自动组合装置 eM_Plant automatic virtual wafer fabrication assemblies-eM_Plant automatic virtual wafer fabrication assemblies
dsp-project-final
- SILICON WAFER DEFECT DETECTION An automated system developed for defect analysis and reporting of defects in a semiconductor wafer-SILICON WAFER DEFECT DETECTION An automated system developed for defect analysis and
edge-eaxm
- 通过对硅片图像的处理，实现对硅片中晶畴边缘的识别以及晶畴个数的统计，从而获得硅片结晶度的信息。克服了以往在太阳能电池生产过程中判断标准不统一、人工漏检等情况的发生，可实现由机器替代人工对每片衬底的检测。 项目的研究成果不仅可以应用在硅片衬底的检测上，对于其他低对比度图像，包含边缘提取以及面积统计等方面的处理，均可采用。这体现了本研究成果具有很强的实用性和很广的应用范围，具有很高的使用价值。 -Through the image
gppve_3_6_navypier_2_0_0
- Intel Atom N270/945GSE的BSP 6.6下使用-Intel Atom N270/945GSE的BSP for workbench3.0 vxworks 6.6
d4ef13.ZIP
- 低温玻璃浆料圆片级真空封装的研究Low temperature glass frit wafer level research on vacuum packaging-Low temperature glass frit wafer level research on vacuum packaging
WafermapDisplay-master
- Drawing wafer use windows form