最新版HotSpot5.02,芯片级的温度计算源码，可对实际芯片内部温度分布进行快速计算。新增的特性支持第二扇热封装，考虑温度对静态功耗的影响，精度到金属互连层。-HotSpot is a computationally efficient, architecture level thermal modeling

infrastructure developed at the University of Virginia. It makes use of the

duality that exists between the electrical and thermal properties of materials to model processor temperature.A simple leakage model interface that allows users to simulate the temperature-leakage interaction