文件名称:TDA2030A-2.1-instruction.doc
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- 软件工程
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- [WORD]
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- 2012-11-26
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- toniele*******
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Amp board will be a little hot when output power is big, so it need a heatsink with big cooling area, to offer good working environment. TDA2030A’s cooling basis plate’s 3 pitches are connective, please use Mica or silica films and Insulating Aprons to insulate the IC and heatsink. The pitch distance is about 20mm, for your reference when drilling on heatsink.
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TDA2030A 2.1 instruction.doc