文件名称:BBGAballgridaG
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BGA(ball grid array)球形触点陈列，表面贴装型封装之一。在印刷基板的背面按陈列方式制作出球形凸点用以 代替引脚，在印刷基板的正面装配LSI 芯片，然后用模压树脂或灌封方法进行行密封。也称为凸点陈列载体(PAC)。引脚可超过200，是多引脚LSI 用的一种封装。封装本体也可做得比QFP(四侧引脚扁平封装)小。例如，引脚中心距为1.5mm 的360 引脚BGA 仅为31
-BGA (ball grid array) spherical contact display, one of the surface mount package. Spherical bump the back of the printed substrate produced according to the display mode to replace the pin in front of the printing substrate assembly LSI chip, and then molded resin or potting seal. Also known as the Braille display vector (PAC). Pin can be over 200, is a multi-pin LSI package. The package body can do than QFP (four side-pin flat package) is small. For example, the pin center distance of only 31 for the 360-pin BGA 1.5mm
-BGA (ball grid array) spherical contact display, one of the surface mount package. Spherical bump the back of the printed substrate produced according to the display mode to replace the pin in front of the printing substrate assembly LSI chip, and then molded resin or potting seal. Also known as the Braille display vector (PAC). Pin can be over 200, is a multi-pin LSI package. The package body can do than QFP (four side-pin flat package) is small. For example, the pin center distance of only 31 for the 360-pin BGA 1.5mm
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BBGAballgridaG\BGA(ball grid array).pdf
BBGAballgridaG
BBGAballgridaG