文件名称:TSV_para
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三维集成电路已成为解决低功耗、高性能、高集成度的电路系统的关键，本程序用于计算三维集成电路中硅通孔TSV的单位电阻、电感、电容参数-The three-dimensional integrated circuits has become the key to solve the low-power, high-performance, highly integrated circuit systems, the program used to calculate the three-dimensional integrated circuit silicon vias TSV unit resistance, inductance, capacitance parameter
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TSV_para.m