文件名称:？
介绍说明－－下载内容均来自于网络，请自行研究使用
用担心QFP 那样的引脚变形问题。
该封装是美国Motorola 公司开发的，首先在便携式电话等设备中被采用，今后在美国有可
能在个人计算机中普及。最初，BGA 的引脚(凸点)中心距为1.5mm，引脚数为225。现在也有
一些LSI 厂家正在开发500 引脚的BGA。
BGA 的问题是回流焊后的外观检查。现在尚不清楚是否有效的外观检查方法。有的认为，
由于焊接的中心距较大，连接可以看作是稳定的，只能通过功能检查来处理。
美国Motorola 公司把用模压树脂密封的封装称为OMPAC，而把灌封方法密封的封装称为
GPAC(见OMPAC 和GPAC)。-To worry about that kind of pin QFP deformation. The package is developed by Motorola, the first portable phones and other devices used in the future in the United States is possible in the popularity of personal computers. Initially, BGA pin (bump) for the center distance of 1.5mm, pin number is 225. LSI now some manufacturers are developing 500-pin BGA. BGA problem is the appearance after reflow inspection. It is not clear whether the appearance of an effective method of examination. Some believe that as a result of welding the center distance of a larger connection can be seen as a stable, only through the function test to deal with it. Motorola United States companies to use molded resin sealed package called OMPAC, and the casting method known as the sealed package GPAC (see OMPAC and GPAC).
该封装是美国Motorola 公司开发的，首先在便携式电话等设备中被采用，今后在美国有可
能在个人计算机中普及。最初，BGA 的引脚(凸点)中心距为1.5mm，引脚数为225。现在也有
一些LSI 厂家正在开发500 引脚的BGA。
BGA 的问题是回流焊后的外观检查。现在尚不清楚是否有效的外观检查方法。有的认为，
由于焊接的中心距较大，连接可以看作是稳定的，只能通过功能检查来处理。
美国Motorola 公司把用模压树脂密封的封装称为OMPAC，而把灌封方法密封的封装称为
GPAC(见OMPAC 和GPAC)。-To worry about that kind of pin QFP deformation. The package is developed by Motorola, the first portable phones and other devices used in the future in the United States is possible in the popularity of personal computers. Initially, BGA pin (bump) for the center distance of 1.5mm, pin number is 225. LSI now some manufacturers are developing 500-pin BGA. BGA problem is the appearance after reflow inspection. It is not clear whether the appearance of an effective method of examination. Some believe that as a result of welding the center distance of a larger connection can be seen as a stable, only through the function test to deal with it. Motorola United States companies to use molded resin sealed package called OMPAC, and the casting method known as the sealed package GPAC (see OMPAC and GPAC).
相关搜索： lsi
(系统自动生成,下载前可以参看下载内容)
下载文件列表
？.txt