在 2010 年的11 月底，德国 acam公司在原有的基础上，又专门针对超声波热量表的一些特

性，进行了更深入的研究和改进，最终推出了新一代针对超声波热量表所设计的的芯片 TDC‐

GP21。这颗芯片为 QFN32 管脚的封装形式。这颗芯片而除了具备了 TDC‐GP2的功能以外，还

额外集成了超声波热量表所需要的信号处理模拟部分，比如模拟开关，以及低噪声斩波稳定

（自动进行温度电压校正）模拟信号比较器，以及内部集成了温度测量所需施密特触发器，使

超声波热量表的设计开发非常简单，大大降低材料和人工成本，并且将测量质量和功耗提升到

了一个前所未有的等级，实现了更高集成度，更低功耗，更高精度的超声波热量表方案。TDC‐

GP21 所能够实现的性能，是 TDC‐GP2所无法达到的。  -In the end of November 2010, Germany acam for on the basis of the original, but also specifically for some of the characteristics of the ultrasonic heat meters to conduct a more in-depth research and improvement, and ultimately launched a new generation of ultrasonic heat meters designed chip TDC- GP21. The chip QFN32-pin package. The chip while the addition with the TDC-GP2, additional integrated signal processing of the analog portion of the ultrasonic heat meters, such as analog switches, and low-noise chopper-stabilized (automatic temperature voltage calibration) analog signal and internal integration required for temperature measurement Schmitt trigger, the design and development of ultrasonic heat meter is very simple, and greatly reduce material and labor costs, and measuring the quality and power raised to an unprecedented level, to achieve a higher integration, lower power consumption, more accurate ultrasonic heat meter program. Performance can be achieved by the TDC-GP21, th