文件名称:DS130218B20()
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通过几个芯片模块的应用，来达到开发板能够测试的目的-Through the application of several chip modules, to achieve the purpose of the development board to test
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下载文件列表
DS1302+18B20(模块，数码管显示)
..............................\138_573_1302.PWI
..............................\138_573_1302_1820.DSN
..............................\138_573_1302_1820.PWI
..............................\138dual - 2.PWI
..............................\1602.h
..............................\18b20.h
..............................\DS1302TEST
..............................\DS1302TEST.C
..............................\DS1302TEST.LST
..............................\DS1302TEST.M51
..............................\DS1302TEST.OBJ
..............................\DS1302TEST.Opt
..............................\DS1302TEST.Uv2
..............................\DS1302TEST.hex
..............................\DS1302TEST.lnp
..............................\DS1302TEST.plg
..............................\DS1302TEST_Opt.Bak
..............................\DS1302TEST_Uv2.Bak
..............................\Last Loaded 138_573_1302.DBK
..............................\Last Loaded 138_573_1302_1820.DBK
..............................\delay
..............................\delay.h
..............................\ds1302.h
..............................\fmq.h