随着可编程器件(PLD) 密度和I/O 引脚数量的增加，对小封装和各种封装

形式的需求在不断增长。球栅阵列(BGA) 封装在器件内部进行I/O 互联，

提高了引脚数量和电路板面积比，是比较理想的封装方案。在相同面积

上，典型的BGA 封装互联数量是四方扁平(QFP) 封装的两倍。而且，BGA

焊球要比QFP 引线强度高的多，可靠的封装能够承受更强的冲击。

Altera 为高密度PLD 用户开发了高密度BGA 解决方案。这种新的封装形

式占用的电路板面积不到标准BGA 封装的一半。

本应用笔记旨在帮助您完成Altera 高密度BGA 封装的印刷电路板(PCB)

设计，并讨论：

■ BGA 封装简介

■ PCB 布板术语

■ 高密度BGA 封装PCB 布板-As programmable logic devices (PLDs) increase in density and I/O pins,

the demand for small packages and diverse packaging options continues

to grow. Ball-grid array (BGA) packages are an ideal solution because the

I/O connections are on the interior of the device, improving the ratio

between pin count and board area. Typical BGA packages contain up to

twice as many connections as quad flat pack (QFP) packages for the same

area. Further, BGA solder balls are considerably stronger than QFP leads,

resulting in robust packages that can tolerate rough handling.

Altera has developed high-density BGA solutions for users of

high-density PLDs. These new formats require less than half the board

space of standard BGA packages.

This application note provides guidelines for designing your printed

circuit board (PCB) for Altera’s high-density BGA packages and

discusses:

■ Overview of BGA Packages

■ PCB Layout Terminology

■ PCB Layout for High-Density BGA Packages