文件名称:BGA1
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本应用指南针对 FT256 1 mm BGA 封装的 Spartan™ -3E FPGA，讨论了低成本、四至六层、
大批量印刷电路板 (PCB) 的布局问题，同时探讨高速信号和信号完整性 (SI) 因素对低层数 PCB
布局的影响。-Application Guide for the FT256 1 mm BGA package, Spartan ™-3E FPGA, the discussion of the low-cost, four to six, high-volume printed circuit board (PCB) layout issues, and exploring the possibility of high-speed signals and signal integrity (SI) factor PCB layout of the low-impact.
大批量印刷电路板 (PCB) 的布局问题，同时探讨高速信号和信号完整性 (SI) 因素对低层数 PCB
布局的影响。-Application Guide for the FT256 1 mm BGA package, Spartan ™-3E FPGA, the discussion of the low-cost, four to six, high-volume printed circuit board (PCB) layout issues, and exploring the possibility of high-speed signals and signal integrity (SI) factor PCB layout of the low-impact.
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BGA1.pdf